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Surface Mount Device Assembly     SMT operation is structured by hi-tech automated machinery technique. The computer program-based operation is run using computerized machinery. With our advanced hi-tech machinery, we are able to provide the following services:   a. Solder Paste Printing and Adhesive Bond Dispensing b. High Precision Fine Pitch IC, QFP and BGA Mounting c. High Speed on SMT Chip Mounting d. Leadfree Capability   MEI has 6 lines of SMT Machinery with a total production rate of 50 million mounting points per month.

 

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