Surface Mounting Device Assembly
SMT operation is structured by hi-tech automated machinery technique. The computer program-based operation is run using computerized machinery. With our advanced hi-tech machinery, we are able to provide the following services:
- Solder Paste Printing and Adhesive Bond Dispensing
- High Precision Fine Pitch IC, QFP and BGA Mounting
- High Speed on SMT Chip Mounting
- Leadfree Capability
MEI has 6 lines of SMT Machinery with a total production rate of 50 million mounting points per month.